P. Chaparala : rechercher sur Z-Library

Le plus grand référentiel d'articles scientifiques au monde. 70,000,000+ d'articles gratuitement.

Don't use scam websites

Livres
Articles (196)
Les plus populaires
Liste
- Liste
- Tableau

1

Optimizing the hot carrier reliability of N-LDMOS transistor arrays

Douglas Brisbin, Andy Strachan, Prasad Chaparala

Journal:

Microelectronics Reliability

Année:

2005

Langue:

english

Fichier:

PDF, 791 KB

english, 2005

2

[IEEE 2017 First International Conference on Recent Advances in Aerospace Engineering (ICRAAE) - Coimbatore, India (2017.3.3-2017.3.4)] 2017 First International Conference on Recent Advances in Aerospace Engineering (ICRAAE) - Design and optimization of aerospike nozzle using CFD

Kumar, K Naveen, Gopalsamy, M, Antony, Daniel, Krishnaraj, R, Viswanadh, Chaparala B V, Lyle, J Livil

Année:

2017

Langue:

english

Fichier:

PDF, 762 KB

english, 2017

3

A new physics-based model for time-dependent Dielectric breakdown

B.J. Schlund, J. Suehle, C. Messick, P. Chaparala

Journal:

Microelectronics Reliability

Année:

1996

Langue:

english

Fichier:

PDF, 265 KB

english, 1996

4

Optimized temperature-pulse sequences for the enhancement of chemically specific response patterns from micro-hotplate gas sensors

R.E. Cavicchi, J.S. Suehle, K.G. Kreider, M. Gaitan, P. Chaparala

Journal:

Sensors and Actuators B: Chemical

Année:

1996

Langue:

english

Fichier:

PDF, 770 KB

english, 1996

5

Impact of NBTI and HCI on PMOSFET threshold voltage drift

Prasad Chaparala, Douglas Brisbin

Journal:

Microelectronics Reliability

Année:

2005

Langue:

english

Fichier:

PDF, 376 KB

english, 2005

6

Effect of geometry and temperature cycle on the reliability of WLCSP solder joints

Chaparala, S.C., Roggeman, B.D., Pitarresi, J.M., Sammakia, B.G., Jackson, J., Griffin, G., McHugh, T.

Journal:

IEEE Transactions on Components and Packaging Technologies

Année:

2005

Langue:

english

Fichier:

PDF, 855 KB

english, 2005

7

[IEEE 2001 IEEE International Integrated Reliability Workshop. Final Report - Lake Tahoe, CA, USA (15-18 Oct. 2001)] 2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580) - Hot-carrier reliability and design of N-LDMOS transistor arrays

Brisbin, D., Strachan, A., Chaparala, P.

Année:

2001

Langue:

english

Fichier:

PDF, 449 KB

english, 2001

8

[IEEE 2006 IEEE International Reliability Physics Symposium Proceedings - San Jose, CA, USA (2006.03.26-2006.03.30)] 2006 IEEE International Reliability Physics Symposium Proceedings - Substrate Current Independent Hot Carrier Degradation in NLDMOS Devices

Brisbin, D., Lindorfer, P., Chaparala, P.

Année:

2006

Langue:

english

Fichier:

PDF, 309 KB

english, 2006

9

Anomalous Safe Operating Area and Hot Carrier Degradation of NLDMOS Devices

Brisbin, D., Lindorfer, P., Chaparala, P.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2006

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2006

10

[IEEE 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - San Jose, CA, USA (April 17-21, 2005)] 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - Electrical characteristics and reliability of extended drain voltage NMOS devices with multi-RESURF junction

Vashchenko, V.A., Brisbin, D., Linclorfer, P., Chaparala, P., Hopper, P.

Année:

2005

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2005

11

[IEEE 2004 International Conference on Integrated Circuit Design and Technology - Austin, TX, USA (17-20 May 2004)] 2004 International Conference on Integrated Circuit Design and Technology (IEEE Cat. No.04EX866) - Plasma damage considerations involving metal-insulator-metal (MIM) capacitors

O'Connell, B., Thibeault, T., Chaparala, P.

Année:

2004

Langue:

english

Fichier:

PDF, 296 KB

english, 2004

12

Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment

Madduri, Sushma, Sammakia, Bahgat G., Infantolino, William, Chaparala, Satish C., Hughes, Lawrence C., Harris, J. Micheal

Journal:

Journal of Electronic Packaging

Année:

2012

Langue:

english

Fichier:

PDF, 1.30 MB

english, 2012

13

[ASME ASME 2006 International Mechanical Engineering Congress and Exposition - Chicago, Illinois, USA (November 5 – 10, 2006)] Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology - Effect of Dwell Times and Ramp Rates on the Thermal Cycling Reliability of Pb-Free Wafer-Level Chip Scale Packages: Experiments and Modeling

Chaparala, S., Pitarresi, J. M., Meilunas, M.

Année:

2006

Langue:

english

Fichier:

PDF, 291 KB

english, 2006

14

Characterization of time-dependent dielectric breakdown in intrinsic thin SiO2

John S. Suehle, Prasad Chaparala

Journal:

Microelectronics Journal

Année:

1996

Langue:

english

Fichier:

PDF, 550 KB

english, 1996

15

Evaluation of performance–reliability trade-offs in a Si–Ge BiCMOS process using fast wafer level techniques

Barry O'Connell, Prasad Chaparala, Bhola Mehrotra

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 508 KB

english, 2004

16

Influence of mobility model on extraction of stress dependent source–drain series resistance

M.M. De Souza, S.K. Manhas, D. Chandra Sekhar, A.S. Oates, P. Chaparala

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 427 KB

english, 2004

17

Influence of test techniques on soft breakdown detection in ultra-thin oxides

Douglas Brisbin, Prasad Chaparala

Journal:

Microelectronics Reliability

Année:

2002

Langue:

english

Fichier:

PDF, 290 KB

english, 2002

18

Selected-area deposition of multiple active films for conductometric microsensor arrays

S. Semancik, R.E. Cavicchi, K.G. Kreider, J.S. Suehle, P. Chaparala

Journal:

Sensors and Actuators B: Chemical

Année:

1996

Langue:

english

Fichier:

PDF, 656 KB

english, 1996

19

Intramuscular Neostigmine and Glycopyrrolate Safely Accelerated Bowel Evacuation in Patients with Spinal Cord Injury and Defecatory Disorders

Alan S. Rosman, Geeta Chaparala, Amit Monga, Ann M. Spungen, William A. Bauman, Mark A. Korsten

Journal:

Digestive Diseases and Sciences

Année:

2008

Langue:

english

Fichier:

PDF, 210 KB

english, 2008

20

Design Guidelines for Efficient Thermal Management of Mid-Infrared Quantum Cascade Lasers

Chaparala, S.C., Feng Xie, Caneau, C., Chung En Zah, Hughes, L.C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 789 KB

english, 2011

21

[IEEE Proceedings of 1994 IEEE International Reliability Physics Symposium - San Jose, CA, USA (1994.04.11-1994.04.14)] Proceedings of 1994 IEEE International Reliability Physics Symposium RELPHY-94 - Field and temperature acceleration of time-dependent dielectric breakdown in intrinsic thin SiO/sub 2/

Suehle, J.S., Chaparala, P., Messick, C., Miller, W.M., Boyko, K.C.

Année:

1994

Langue:

english

Fichier:

PDF, 473 KB

english, 1994

22

[IEEE 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Bangalore, India (2007.07.11-2007.07.13)] 2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability Challenges in Analog and Mixed Signal Technologies

Chaparala, Prasad, Brisbin, Douglas, Kim, Jonggook, OConnell, Barry

Année:

2007

Langue:

english

Fichier:

PDF, 3.64 MB

english, 2007

23

[IEEE IEEE International Integrated Reliability Workshop - Lake Tahoe, CA, USA (21-24 Oct. 2002)] IEEE International Integrated Reliability Workshop Final Report, 2002. - 1-D and 2-D hot carrier layout optimization of N-LDMOS transistor arrays

Brisbin, D., Strachan, A., Chaparala, P.

Année:

2002

Langue:

english

Fichier:

PDF, 318 KB

english, 2002

24

[IEEE International Reliability Physics Symposium - Dallas, TX, USA (30 March-4 April 2003)] 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual. - Design optimization of N-LDMOS transistor arrays for hot carrier lifetime enhancement

Brisbin, D., Strachan, A., Chaparala, P.

Année:

2003

Langue:

english

Fichier:

PDF, 148 KB

english, 2003

25

[IEEE 2002 IEEE International Reliability Physics Symposium Proceedings. 40th Annual - Dallas, TX, USA (7-11 April 2002)] 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320) - Hot carrier reliability of N-LDMOS transistor arrays for power BiCMOS applications

Brisbin, D., Strachan, A., Chaparala, P.

Année:

2002

Langue:

english

Fichier:

PDF, 372 KB

english, 2002

26

[IEEE 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - San Jose, CA, USA (April 17-21, 2005)] 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual. - Anomalous NMOSFET hot carrier degradation due to trapped positive charge in a DGO CMOS process

Brisbin, D., Mirgorodski, Y., Chaparala, P.

Année:

2005

Langue:

english

Fichier:

PDF, 1009 KB

english, 2005

27

A New Fast-Switching NBTI Characterization Method That Determines Subthreshold Slope Degradation

Brisbin, D., Chaparala, P.

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2009

Langue:

english

Fichier:

PDF, 430 KB

english, 2009

28

[IEEE IEEE International Integrated Reliability Workshop Final Report, 2004 - S. Lake Tahoe, CA, USA (Oct. 18-21, 2004)] IEEE International Integrated Reliability Workshop Final Report, 2004 - Impact of buried layer processing on gate oxide integrity

O'Connell, B., Yang, R., Yindeepol, W., De Santis, J., Strachan, A., Coppock, W., Foote, R., Dark, C., Sethna, P., Chaparala, P.

Année:

2004

Langue:

english

Fichier:

PDF, 337 KB

english, 2004

29

[IEEE 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2010) - Singapore, Singapore (2010.07.5-2010.07.9)] 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Reliability qualification of photovoltaic smart panel electronics

Chaparala, Prasad, Erhong Li,, Bhola, Sameer

Année:

2010

Langue:

english

Fichier:

PDF, 719 KB

english, 2010

30

[IEEE IEEE 1995 International Integrated Reliability Workshop. Final Report - Lake Tahoe, CA, USA (22-25 Oct. 1995)] IEEE 1995 International Integrated Reliability Workshop. Final Report - Assessing MOS gate oxide reliability on wafer level with ramped/constant voltage and current stress

Martin, A., Suehle, J., Chaparala, P., O'Sullivan, P., Mathewson, A., Messick, C.

Année:

1995

Langue:

english

Fichier:

PDF, 961 KB

english, 1995

31

Vortex-state resistance near parallel orientation in layered superconductors

Chaparala, M., Chung, O. H., Ren, Z. F., White, M., Coppens, P., Wang, J. H., Hope, A. P., Naughton, M. J.

Journal:

Physical Review B

Année:

1996

Langue:

english

Fichier:

PDF, 195 KB

english, 1996

32

The Evolution of Capacitors [History]

Brusso, Barry, Chaparala, Satish

Journal:

IEEE Industry Applications Magazine

Année:

2014

Langue:

english

Fichier:

PDF, 2.57 MB

english, 2014

33

A MEMS diamond hemispherical resonator

Bernstein, J J, Bancu, M G, Cook, E H, Chaparala, M V, Teynor, W A, Weinberg, M S

Journal:

Journal of Micromechanics and Microengineering

Année:

2013

Langue:

english

Fichier:

PDF, 1.90 MB

english, 2013

34

Classical and quantum magnetic phenomena in natural and artificial ferritin proteins

Gider, S, Awschalom, D., Douglas, T, Mann, S, Chaparala, M

Journal:

Année:

1995

Langue:

english

Fichier:

PDF, 1.08 MB

english, 1995

35

[IEEE 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Enschede, The Netherlands (8-11 October 1996)] Proceedings of the 7th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - A new physics-based model for time dependent dielectric breakdown

Schlund, B.I., Suehle, J., Messick, C., Chaparala, P.

Année:

1996

Langue:

english

Fichier:

PDF, 271 KB

english, 1996

36

Does Stone Removal Help Patients with Recurrent Urinary Tract Infections?

Omar, Mohamed, Abdulwahab-Ahmed, Abdullahi, Chaparala, Hemant, Monga, Manoj

Journal:

The Journal of Urology

Année:

2015

Langue:

english

Fichier:

PDF, 248 KB

english, 2015

37

[IEEE 2014 International Semiconductor Laser Conference (ISLC) - Palma de Mallorca, Spain (2014.9.7-2014.9.10)] 2014 International Semiconductor Laser Conference - Tuning Efficiency and Modulation Speed of Epi-Up and Epidown Mounted Distributed Feedback Quantum Cascade Laser

Xie, Feng, Caneau, Catherine, Chaparala, Satish, Leblanc, Herve P., Ho, Ming-Tsung, Coleman, Sean, Hughes, Lawrence C., Zah, Chung-En

Année:

2014

Langue:

english

Fichier:

PDF, 356 KB

english, 2014

38

PD8-05 DOES STONE REMOVAL HELP PATIENTS WITH RECURRENT URINARY TRACT INFECTIONS?

Omar, Mohamed, Chaparala, Hemant, Ahmed, Abdullahi, Monga, Manoj

Journal:

The Journal of Urology

Année:

2015

Langue:

english

Fichier:

PDF, 66 KB

english, 2015

39

[ASME ASME 2004 International Mechanical Engineering Congress and Exposition - Anaheim, California, USA (November 13 – 19, 2004)] Dynamic Systems and Control, Parts A and B - Real-Time Subspace Identification and Optimal Control for Active Noise Cancellation

Pongpairoj, Harin, Chaparala, Vineet, Pourboghrat, Farzad

Année:

2004

Langue:

english

Fichier:

PDF, 241 KB

english, 2004

40

RCA and IMEC/SC2 Clean: Metallic Immunity and Gate Oxide Integrity

Chen, Weidong, Dhayagude, Tushar, Chaparala, Prasad, Demirlioglu, Esin, Shenasa, Mohsen, Bearda, Twan, Arnauts, Sophia, Meuris, Marc

Journal:

MRS Proceedings

Année:

1997

Langue:

english

Fichier:

PDF, 333 KB

english, 1997

41

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Chaparala, S., Pitarresi, J. M., Parupalli, S., Mandepudi, S., Meilunas, M.

Journal:

Journal of Electronic Packaging

Année:

2006

Langue:

english

Fichier:

PDF, 948 KB

english, 2006

42

Special Section on InterPACK 2013

Chaparala, Satish, Gupta, Ashish, Hoivik, Nils, Lee, Y. C.

Journal:

Journal of Electronic Packaging

Année:

2014

Langue:

english

Fichier:

PDF, 75 KB

english, 2014

43

Special Section on InterPACK 2015

Chaparala, Satish, Gupta, Ashish, Asheghi, Mehdi, Suhling, Jeffrey, Ikeda, Toru, Luo, Xiaobing

Journal:

Journal of Electronic Packaging

Année:

2016

Langue:

english

Fichier:

PDF, 79 KB

english, 2016

44

MP11-03 CONTEMPORARY IMAGING PRACTICE PATTERNS AFTER URETEROSCOPY FOR STONE DISEASE

Omar, Mohamed, Chaparala, Hemant, Monga, Manoj, Sivalingam, Sri

Journal:

The Journal of Urology

Année:

2015

Langue:

english

Fichier:

PDF, 370 KB

english, 2015

45

Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages

Rayasam, M., Chaparala, S., Farnam, D., Sammakia, B. G., Subbarayan, G.

Journal:

Journal of Electronic Packaging

Année:

2009

Langue:

english

Fichier:

PDF, 1.02 MB

english, 2009

46

Design and Optimization of Aerospike nozzle using CFD

Naveen Kumar, K, Gopalsamy, M, Antony, Daniel, Krishnaraj, R, Viswanadh, Chaparala B V

Journal:

IOP Conference Series Materials Science and Engineering

Année:

2017

Langue:

english

Fichier:

PDF, 1.81 MB

english, 2017

47

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly With Sn3.9Ag0.6Cu SAC Alloy

Xiao, Qiang, Armstrong, William D., Pitarresi, James M., Chaparala, Satish C., Rogeman, Brian D., Sammakia, Bahgat G., Nguyen, Luu

Année:

2005

Langue:

english

Fichier:

PDF, 1.53 MB

english, 2005

48

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP)

Chaparala, Satish C., Andros, Frank E., Infantolino, Bill, Sammakia, Bahgat G., Guttikonda, Satish C., Zhao, Julia, Sengupta, Dipak

Année:

2005

Langue:

english

Fichier:

PDF, 369 KB

english, 2005

49

How accurate are we in measuring stone volume? A comparison of water displacement, ellipsoid formula, and a CT-based software tool.

Jain, Rajat, Omar, Mohamed, Chaparala, Hemant, Kahn, Adam, Li, Jianbo, Kahn, Leonard, Sivalingam, Sri

Journal:

Journal of Endourology

Année:

2018

Langue:

english

Fichier:

PDF, 504 KB

english, 2018

50

Outcomes in adult pectus excavatum patients undergoing Nuss repair

Ewais, MennatAllah, Chaparala, Shivani, Uhl, Rebecca, Jaroszewski, Dawn

Journal:

Patient Related Outcome Measures

Année:

2018

Langue:

english

Fichier:

PDF, 4.03 MB

english, 2018